BAD HARDWARE WEEK

Mr. Edelstein is leading a team of researchers from inside and outside I.B.M. in developing a new way to solve the problem: using “self assembling” nanotechnology to make better insulators, raising performance. In this case, self-assembly involves creating so-called airgaps, vacuums a few nanometers wide that keep the billions of tiny copper wires in a chip from touching one another, instead of putting down a layer of insulating material and trying to align it effectively at the nanoscale. It’s more efficient, and it means that I.B.M. won’t need to spend $50 million on photolithographic equipment.