Friday, July 31, 2015
MH370 flight had enough fuel to hit naval base Diego Garsia
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99% BAD HARDWARE WEEK: And had practised landing on Diego Garcia, a month earlier ! If you were MH370 debris chose yourself shorter and more probable way to place you will be eventualy find. Now lets try an experiment. Drop two boeing 777 flaperons with GPS and ACAR emitter at the encircled zones, in the picture above. If no one to be delivered to Reunion beach in the next 15 months, then I am simply wrong. Oh by the way, why didn't ever get to Diego Garsia ?? Strong head winds. If it continued to fly toward China those shoul be helping tail one.
MH 370 never fell even close to Australia shores
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99% BAD HARDWARE WEEK: British are obviously deliberately inclouded in cover-up. MH370 debris shoud be much ealier showed up at the Australia coast then anywhere else. And never did, after australian expert Pattaratchi simulation of Indian ocean currents.
Philae lander at comet found 16 organic compounds
16 organic compounds, including many nitrogen-bearing species but no sulfur-bearing species, and four compounds—methyl isocyanate, acetone, propionaldehyde, and acetamide—that had not previously been reported in comets
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99% BAD HARDWARE WEEK: However, no sulphur compounds traces, thus Hell must be on Earth !! Actually inside, just as Bible points.
Wednesday, July 29, 2015
Debris of missing MH370 airplane found
Debris Shows MH370 Didn’t Nose Dive
The
piece recovered on Réunion would’ve been destroyed in a high-speed
crash, a source close to the Boeing 777 program says.
“It looks like the jet went into the water in a gliding/ditching attitude, because otherwise this wing component would have likely been completely destroyed.”That means the plane was a ‘zombie’ when it finally went down.
“It looks like the jet went into the water in a gliding/ditching attitude, because otherwise this wing component would have likely been completely destroyed.”That means the plane was a ‘zombie’ when it finally went down.
99% BAD HARDWARE WEEK: Some 5000 km from Australia shores. It fell when left without fuel. Previsously has been seen by Maldivi fishermen, marked at the map above with a red sign. On a flight path apsolutely consistent with last radar screening. Or, some 700 km before Diago Garsia naval base. Both versions are easy testable. Instead, someone suddenly found pings close at the Australia shores. But, intuition tells us that airplane have to fall alone ! Well, there are some cases of gentle autolanding.
After the pilot ejection, the aircraft recovered from the spin on its own, and established a wings level low rate descent under reduced power to the ground. Ground effect broke its rate of descent, and it settled into a
near-perfect gentle belly landing in a farmer's snow-covered cornfield.
Tuesday, July 28, 2015
Micron And Intel Partner On New Fast Non Volatile Technology 3D XPoint
3D XPoint is in production now and is the first new category of memory introduced in over 25 years.
Probably low cost design in 2016 and performance design in 2018, leaked roadmaps suggest.
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99% BAD HARDWARE WEEK: But, unfortunately it is still not quite as fast as RAM, and some - but not all - applications need the extra speed the older tech provides. And don't forget distinction : DRAM and Xpoint are cell adressable, but NAND is only block, so it is slower, depending on block size. But, without transistor cell drive, 8 times denser than DRAM USING VERTICAL FAST SCHOTTKY DIODE as a control device. THOUGH INEVITABLY SAY 10 TIMES SLOWER. But, the best performance oriented XPoint designs are able to switch in 70-140ns. That is wow, compared to 30ns cycle time of DDR4.
Now, lets see an industrial standard. In 2016 however don't expect product read able faster than 600 ns.
Monday, July 27, 2015
New arms race : Military AI
Hawking, Musk, Wozniak warn of military artificial intelligence arms race
Artificial Intelligence (AI) technology has reached a point where the deployment of such systems is — practically if not legally — feasible within years, not decades, and the stakes are high: autonomous weapons have been described as the third revolution in warfare, after gunpowder and nuclear arms.
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99% BAD HARDWARE WEEK:
Monday, July 20, 2015
Beware of big hacking drones
Email conversations posted on WikiLeaks reveal that Boeing and Hacking Team want drones to carry devices that inject spyware into target computers through WiFi networks
Installing the technology on drones creates a powerful threat because drones are mobile and often out of sight for pedestrians, enabling them to follow people undetected.
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99% BAD HARDWARE WEEK: And finally, merriage of the two most desirable spying tools.
Latest spying option is for Win 10 and Edge Browser !! AND YOU THINK YOU ARE SECURE WITH MICROSOFT ! Maturity of this product sugest that spies are familiar with Facebook, Skype and almost all your other accounts. 24+ hours in one flight operation.
Installing the technology on drones creates a powerful threat because drones are mobile and often out of sight for pedestrians, enabling them to follow people undetected.
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99% BAD HARDWARE WEEK: And finally, merriage of the two most desirable spying tools.
Latest spying option is for Win 10 and Edge Browser !! AND YOU THINK YOU ARE SECURE WITH MICROSOFT ! Maturity of this product sugest that spies are familiar with Facebook, Skype and almost all your other accounts. 24+ hours in one flight operation.
Intel plans in short
Skylake is a new Morphore architecture driven by new Win 10
2H 2016 Kaby Lake is silicon optimized Skylake
2H 2017 10 nm Ice Lake
CannonLake is fake
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99% BAD HARDWARE WEEK: 36 months for complete New Cycle, 12 months for each subcycle.
Friday, July 17, 2015
Google self-driving car involved in accident, 4 injured
In California, a person must be behind the wheel of a self-driving car being tested on public roads to take control in an emergency. Google typically sends another employee in the front passenger seat to record details of the ride on a laptop. In this case, there was also a back seat passenger.
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99% BAD HARDWARE WEEK: Not guilty, I swear.
Thursday, July 16, 2015
Gray Silicon and FPGAs
For the past few years, we’ve all been hearing the discussions about “Dark Silicon.” Besides being a really cool and ominous-sounding label, dark silicon is an issue that threatens to end multicore scaling on ICs. The reasoning goes like this: “Dennard Scaling” has ended. Dennard Scaling is the concept that power density remains constant as transistors shrink, which gives “Koomey’s Law” its teeth. Koomey’s Law says that performance-per-watt in computation has been improving by approximately a factor of two every 1.57 years.
At the most recent process nodes, the amount of
leakage current has caused Dennard Scaling to break down, and power
density has been increasing rapidly. Increasing power density on top of
Moore’s Law means that even though we can put more transistors on a
chip, we can’t let them operate all at the same time without thermal
runaway. We have to leave some of them dark at all times - hence, “dark
silicon.”
The reason why FPGAs don't suffer from the dark silicon as much as CPUs/GPUs is that the switching is more spread out than in ALU based architectures.
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99% BAD HARDWARE WEEK: Intel had obviously a lot of gray reasons for a recent purchase of Altera IP.
Moore's law clock late
Now TICK is 15 months and TOCK too.
Five years plan for halving geometry !
Intel will launch its first 10nm product, codenamed Cannonlake, in the second half of 2017.
Only in second half of year 2022 we will see Intel's 5 nm products based on revisited Moore's law.
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99% BAD HARDWARE WEEK: And it is now called Ice Lake, being so hot product :)
Five years plan for halving geometry !
Intel will launch its first 10nm product, codenamed Cannonlake, in the second half of 2017.
Only in second half of year 2022 we will see Intel's 5 nm products based on revisited Moore's law.
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99% BAD HARDWARE WEEK: And it is now called Ice Lake, being so hot product :)
China should get 100+ Petaflops supercomputer in November 2015
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99% BAD HARDWARE WEEK: USA will be behind till 2017 ! OR EVEN LATER, provided Tianhe 3 is in the China state's 13th 5 year plan ! Being Xeon Xeon E5-2622 v3 is a 22nm product any sell ban to CHina could switch it to Shenwei DEC ALpha base home grown RISC chips in 32 nm, though much more power efficient than Xeon.
Wednesday, July 15, 2015
Complete confusion at Intel
Phone and tablet 10nm Canon LAke processors are still possible in 2H 2016. But Ice Lake should be FIVR based and thus no need for such a bold moves at the bottom line. Resetting the tick-tock cycle based on that timetable, the first 10nm processors would be in computers late next year, with a broad rollout in 2017.
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99% BAD HARDWARE WEEK: Flat revenue for Intel this, and next year too. At best. OR, even worse.
Intel's first 10 nm chip is Ice Lake in 2017
Intel’s first 10nm central processing units will be code-named “Ice Lake” and will be available only in 2017. Moreover, “Ice Lake” CPUs will re-introduce fully-integrated voltage regulator (FIVR). This allows the SoC to reduce the voltage during relatively short time periods, i.e. ~200 cycles while waiting for a L2 cache miss to return, or boost the voltage to speedup the execution of critical sections.
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99% BAD HARDWARE WEEK: There is some doubt that even Ice Lake chip is a 14 nm based Morphcore architecture. That will finally go back to FIVR. Do we have in 2016 architecture and clock flashback that we have had in 2006 ? AND NOBODY HAD HAD EVEN SLIGHTEST IDEA. But we know that FIVR is able to independently scale voltage to each core. Including GPU ! If in addition each core can in flight MORPH to power conscious mode, that would rock real world processor power consumption. That is why Skylake doesn't have FIVR. To hide MORPH underlaying architecture, until Win 10 get serious device driver support. Beside 10nm process should have lower voltage or on the contrary it is hardly new process at all !
After glossy paper launch, Intel quitely delays SkaFake to Q4 !
Facing the yield challenges in the 14nm process, Intel Corporation is likely to postpone the launch of Skylake, the 6th generation desktop processor, to Q4 2015.
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99% BAD HARDWARE WEEK: FINFET proces variability to blame. Besideweak PC demand.
10 nm now seems pretty far away. With interim Kaby Lake.
"Kaby Lake" chipsets will get integrated a native USB 3.1 support from Intel.
Tuesday, July 14, 2015
HAL, open that bloody doors ! NOW
Sixty-five THOUSAND Range Rovers recalled over door software glitch. Yes, door software. Like on the Heart of Gold, presumably.
The affected vehicles were manufactured with doors that can remain unlatched with the door is in the “closed” position, without any indication to the driver that a latch is not secure.
It is believed that a handheld "black box" was being used by some gangs to unlock and start cars that had keyless ignition systems.
Some newspapers reported that insurers were unwilling to extend cover to Range Rover owners unless they could park in secure, off-street car parks.
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99% BAD HARDWARE WEEK: What about Space Odyssey 2001, though from one lesser known British writer Arthur Clarke ? And his machine intelligence character HAL 9000 ? Luckily, Rovers doesn't have HAL control unit (yet) to blame for all.
Monday, July 13, 2015
Hacking Team Hacked
Italian cybersecurity firm Hacking Team said a government might have been behind a massive hack of its systems and warned that the subsequent
leaking of its computer codes could prove to be a field day for
criminals. Unknown hackers last week downloaded 400GB of data from the firm, which
makes surveillance software that allows law enforcement and intelligence
agencies to tap into the phones and computers of suspects.
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99% BAD HARDWARE WEEK: Sensitive data Wikileaked.
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99% BAD HARDWARE WEEK: Sensitive data Wikileaked.
Sunday, July 12, 2015
TMSC delays 10 nm too
Saturday, July 11, 2015
A closer look at the 7nm node announcement
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99% BAD HARDWARE WEEK: Do you think this a functional 7nm chip ? Perhaps some elements of bus and memory cells and nothing more. EUV ? Don't kidding me. Immersed 7nm exposed to ArF requiers 34 litography and double of that OVL steps. Current weak EUV throughput should be comparable to that in a low productivity. What about hybrid of lower steps using EUV and the others by ArF sources ? 7nm in that case shouldn't be more that half-node or in Intel's terminology TIC move.
99% BAD HARDWARE WEEK: Do you think this a functional 7nm chip ? Perhaps some elements of bus and memory cells and nothing more. EUV ? Don't kidding me. Immersed 7nm exposed to ArF requiers 34 litography and double of that OVL steps. Current weak EUV throughput should be comparable to that in a low productivity. What about hybrid of lower steps using EUV and the others by ArF sources ? 7nm in that case shouldn't be more that half-node or in Intel's terminology TIC move.
Friday, July 10, 2015
The end of the road(map)
In the future, the semiconductor industry may diverge into two segments. One segment may focus on specialty applications using thin-body structures like the FinFET and high-mobility channel materials for server and datacenter applications where chip costs are of less concern. Another segment may pursue more manufacturable transistor designs like the SegFET for mobile devices and sensors, for which low cost (rather than performance) is a major determining factor in product success.
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99% BAD HARDWARE WEEK: IBM's 7 nm process is improvement in electron and hole mobility rather than in device geometry. Without process variability problems like at Intel.
Thursday, July 09, 2015
IBM's 7nm SiGe process
This should be 10 nm chip with a 33 nm pitch, not a 7 nm one !
IBM said that would make it possible to build microprocessors with more than 20 billion transistors.The company said on Thursday that it had working samples of chips with seven-nanometer transistors. It made the research advance by using silicon-germanium instead of pure silicon in key regions of the molecular-size switches. The upshot of all of this is that IBM and its OpenPower partners have a line of sight well beyond 2020 for Power10 and possibly for Power11 chips. That all depends on if this 7 nanometer process can be commercialized and brought to Globalfoundries’ chip plants in an economical and timely fashion.
The finfet transistors using SiGe in the channel. were fabricated using self-aligned quadruple patterning (SAQR) .
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99% BAD HARDWARE WEEK: 7 nm SiGe FINFETs with 33 nm pitch and improved electrostatics only in 2020.
Wherever 10 nanometer processes are deployed, given a roughly same die size, a Power9 chip could have around 10 billion transistors – more than twice what is possible on the Power8 chip. Power10 in 7 nm could have 20 billion transistors.
IBM said that would make it possible to build microprocessors with more than 20 billion transistors.The company said on Thursday that it had working samples of chips with seven-nanometer transistors. It made the research advance by using silicon-germanium instead of pure silicon in key regions of the molecular-size switches. The upshot of all of this is that IBM and its OpenPower partners have a line of sight well beyond 2020 for Power10 and possibly for Power11 chips. That all depends on if this 7 nanometer process can be commercialized and brought to Globalfoundries’ chip plants in an economical and timely fashion.
The finfet transistors using SiGe in the channel. were fabricated using self-aligned quadruple patterning (SAQR) .
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99% BAD HARDWARE WEEK: 7 nm SiGe FINFETs with 33 nm pitch and improved electrostatics only in 2020.
Wherever 10 nanometer processes are deployed, given a roughly same die size, a Power9 chip could have around 10 billion transistors – more than twice what is possible on the Power8 chip. Power10 in 7 nm could have 20 billion transistors.
Here is How The Next Tech Crisis Will Play Out
The Fuse on the Global Debt Bomb has been lit. We are now officially in the Crisis to which the 2008 Meltdown was just the warm up.
All told, globally there are $100 trillion in bonds in existence today.
A little over a third of this is in the US. About half comes from developed nations outside of the US. And finally, emerging markets make up the remaining 14%.
Over $100 trillion...the size of the bond bubble alone should be enough to give pause.
However, when you consider that these bonds are pledged as collateral for other securities (usually over-the-counter derivatives) the full impact of the bond bubble explodes higher to $555 TRILLION.
To put this into perspective, the Credit Default Swap (CDS) market that nearly took down the financial system in 2008 was only a tenth of this ($50-$60 trillion).
What does all of this mean?
The $100 trillion bond bubble will implode. As it does, the financial system will begin to deleverage as debt is defaulted on or restructured (reducing the amount of US Dollars in the system, pushing the US Dollar higher).
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99% BAD HARDWARE WEEK:
Thursday, July 02, 2015
FINALLY: Robot killed man
The 22-year-old was part of a team that was setting up the stationary robot when it grabbed and crushed man against a metal plate.
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99% BAD HARDWARE WEEK: Robot's revenge !
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99% BAD HARDWARE WEEK: Robot's revenge !
Wednesday, July 01, 2015
GLOBALFOUNDRIES Completes Acquisition of IBM Microelectronics Business
Microsoft might be interested in buying AMD, according to source
In a bid to revive its chip design operations, Microsoft Corp. may
acquire Advanced Micro Devices, according to a source familiar with the
matter. The software giant approached AMD several months ago, the source
indicated. The result of the talks is unclear.
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99% BAD HARDWARE WEEK: Two drownings together have better survival chances ? HARDLY ! LEt me tell you a secret. In some 10 years world will be dominated by cloud business model, not by Microsoft's usual one. And its hardware by Intel's Xeons. And smartphones (or watches) by Apple ?
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99% BAD HARDWARE WEEK: Two drownings together have better survival chances ? HARDLY ! LEt me tell you a secret. In some 10 years world will be dominated by cloud business model, not by Microsoft's usual one. And its hardware by Intel's Xeons. And smartphones (or watches) by Apple ?