Tuesday, May 06, 2008
Intel to begin chip production on 450 mm wafers in 2012
In the past, migration to the next larger wafer size traditionally began every 10 years after the last transition. For example, the industry began the transition to 300 mm wafers in 2001, a decade after the initial 200 mm manufacturing facilities were introduced in 1991.
Yes, 2012 is 10 years later, but hmm who will in industry follow Intel? Only Samsung or no one else?
That will make 450 mm development costs prohibitively high for Intel. And if something fail, that might be complete disaster, only 4 years ahead.
Yes, 2012 is 10 years later, but hmm who will in industry follow Intel? Only Samsung or no one else?
That will make 450 mm development costs prohibitively high for Intel. And if something fail, that might be complete disaster, only 4 years ahead.
THIS LINK posted by Joseph Bell : 7:46 AM
