Monday, December 22, 2008
IEDM: 450mm wafer fab will cost $10B !
''Is the technology node progression slowing down? Not yet, but it soon will be,'' said Craig Sander, vice president of process R&D at Advanced Micro Devices Inc. (AMD) and the company's foundry spin-off, dubbed The Foundry Co. At 22-nm, ''we are hitting the physical limits (of scaling). After that, things will slow down.''
BAD HARDWARE: If 22 nm is supposed in the year 2012, no more scaling down after that year?
450mm wafers will support Moore's law grow in terms of productivity some time, 3D device integration will help too, but essentially Moore's law will be dead. Provided it speaks about silicon substrate scaling.
BAD HARDWARE: If 22 nm is supposed in the year 2012, no more scaling down after that year?
450mm wafers will support Moore's law grow in terms of productivity some time, 3D device integration will help too, but essentially Moore's law will be dead. Provided it speaks about silicon substrate scaling.
THIS LINK posted by Joseph Bell : 6:09 PM
