Thursday, October 29, 2009

Memory goes to 3D stacking


"A 10-year cycle to take a brand new memory concept into production is actually very aggressive," Fazio said. He said there have been very few new memory technologies introduced since the 1960s, when DRAM, SRAM and EEPROM were developed.

Fazio said PCMS could enable a future class of memories that combine the attributes of memory and storage, offering DRAM-like features, NOR-like features and the cost attributes of NAND for a variety of applications.

BAD HARDWARE question: When the integrated logic gates will move along the 3rd dimension ?. Should start the next year, 2010. However, when at your laptop? Well, that is big, radical change that will need years to be implemented. Integrated 3D logic and stacked memory ? Bingo !

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