Wednesday, July 06, 2011
TSMC may beat Intel introducing 3-D chips
Chip foundry giant Taiwan Semiconductor Manufacturing Co. (TSMC) could deliver its first semiconductors with 3-D interconnects by the end of 2011, potentially beating Intel Corp. to the punch in offering the first 3-D chips, according to a report circulated Tuesday (July 5) by a Taiwan trade group.
THIS LINK posted by Joseph Bell : 8:52 AM
