Tuesday, October 18, 2011
Apple relies on Samsung chips despite patent war
``Samsung Electronics will apply its advanced 28-nanometer processing technology to produce qualified A6 quad core mobile APs. TSMC will provide customized chips with designs from Apple, however, the volume will be very small,’’ said the executive.
BAD HARDWARE WEEK: Korean Times seems confirms BAD HARDWARE here.
28 nm , 2012, Dual core A15. A6 is only its generation name. Dual core is for i Phone 5, Quad core model for Ipad 3.
``With a bigger screen, the surface design of the iPhone 5 will be changed. The iPhone 5 and iPad 3 will be launched within the first quarter of next year,’’ said the executive.
Well, confident sources say this: Foundry chipmaker TSMC is reported to have started trial manufacturing of the A6 processor for Apple. But TSMC has also been reported as planning to put the IC through another tape-out for the "production design" in the first quarter of 2012.
One potential reason of the respin is that TSMC plans to use 3-D stacking technologies along with its 28-nm manufacturing process in the production of the A6 for Apple. The use of a specialized silicon interposer and bump-on-trace interconnect may produce specific requirements in the main processor die.
Packaging house Advanced Semiconductor Engineering Inc. partnered with TSMC to develop the 3-D chip packaging technology and so should benefit from the A6 processor business in 2012, the report said.
28 nm , 2012, Dual core A15. A6 is only its generation name. Dual core is for i Phone 5, Quad core model for Ipad 3.
``With a bigger screen, the surface design of the iPhone 5 will be changed. The iPhone 5 and iPad 3 will be launched within the first quarter of next year,’’ said the executive.
Well, confident sources say this: Foundry chipmaker TSMC is reported to have started trial manufacturing of the A6 processor for Apple. But TSMC has also been reported as planning to put the IC through another tape-out for the "production design" in the first quarter of 2012.
One potential reason of the respin is that TSMC plans to use 3-D stacking technologies along with its 28-nm manufacturing process in the production of the A6 for Apple. The use of a specialized silicon interposer and bump-on-trace interconnect may produce specific requirements in the main processor die.
Packaging house Advanced Semiconductor Engineering Inc. partnered with TSMC to develop the 3-D chip packaging technology and so should benefit from the A6 processor business in 2012, the report said.
THIS LINK posted by Joseph Bell : 8:22 AM
