BAD HARDWARE WEEK

PRIMARY PURPOSE: This position is for a technical individual contributor within the ASTA partnership at IBM's facilities in East Fishkill, NY. The individual selected for this position will work together with AMD and ASTA engineers in IBM's 300mm development facility. Employee will participate in joint development of advanced FEOL etch processes and modules. Projects will include development and optimization of etch processes for STI, Gate (incl. high k and/or metal gate), Si recess, spacer dielectrics, and other FEOL etch modules in 45nm and 32nm technologies, linking with other process engineering and integration groups. In addition to development experience, experience optimizing etch processes for manufacturability will be important.