Tuesday, March 15, 2011
Processor Whispers – About Chancellors and 3D Chips
IBM intends to produce the Power8 processor, planned for 2013 (in 28 or 22nm), using 3D stack technology, with a directly linked memory and also, probably, a layer of small specialized computing cores adapted for specific intended uses. Maybe Intel will surprise us with 3D technology for its Haswell processor scheduled for 2013, perhaps, with a large "stacked" 16MB L3 cache. In any case, the processor's internal use name already includes a 3: H3
BAD HARDWARE: Intel's Rockwell 2014 will integrate in one die all what Haswell did in 2. So, what use of 3D? at Intel? HAswell FMA will use 4 operands FMA. That will require increased bandwidth and 16MB L3 accessed in a more direct way then previously. Oh by the way, IBM uses FMA since 1990 ! At CeBIT, IBM boss Palmisano tactfully covered up the slip-up of the German chancellor Angela Merkel who, during the presentation of IBM's 3D prototype chip, had asked him, "Do you take that from Intel?" His reply, "No, ours are better", was almost drowned by the audience's laughter.
BAD HARDWARE: Intel's Rockwell 2014 will integrate in one die all what Haswell did in 2. So, what use of 3D? at Intel? HAswell FMA will use 4 operands FMA. That will require increased bandwidth and 16MB L3 accessed in a more direct way then previously. Oh by the way, IBM uses FMA since 1990 ! At CeBIT, IBM boss Palmisano tactfully covered up the slip-up of the German chancellor Angela Merkel who, during the presentation of IBM's 3D prototype chip, had asked him, "Do you take that from Intel?" His reply, "No, ours are better", was almost drowned by the audience's laughter.
THIS LINK posted by Joseph Bell : 1:30 PM
