Saturday, October 19, 2013

Exclusive: What is exactly behind Intel's 14nm problems ?

We all know that after scaling problems in past Intel can't be surprised after introduction of development fabs. But now it is obviously in scaling problems, just as BAD HARDWARE predicted. What is really behind Intel's widely shut lips ?

"If you can make them [FinFETs] rectangular you will gain significantly in terms of performance, about a 20 percent gain." "Despite significant differences in the shape of the three fins, the difference in the on-current is within a 4 percent range," the blog states.The characteristic dimensions of three FinFETs were fed into the GSS Garand simulator and it revealed that at 22-nm, nature appears to have worked to Intel's advantage.
Professor Asenov added: "I think Intel just survived at 22-nm. I think bulk FinFETs will be difficult to scale to 16-nm or 14-nm. I think that SOI will help the task of scaling FinFETs to 16-nm and 11-nm. Of course, the wafers are more expensive, but you save money with less processing."
99% BAD HARDWARE WEEK: But alas, nature is not always in Intel's favor. Say at 14nm. Mother nature next favor window is only at 11 nm . In the meantime you will get main stress at Intel at their skilled journalists and spoke men. :)
On a trip to Taiwan last summer, Harvard Business School professor Willy Shih heard that TSMC likely won’t match Intel’s 22-nanometer 3-D transistors for two to four years, a gap he characterized as “enormous.”  Well, Intel itself will not match it seems too for two to four years ! :))))

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