Friday, July 10, 2015
The end of the road(map)
In the future, the semiconductor industry may diverge into two segments. One segment may focus on specialty applications using thin-body structures like the FinFET and high-mobility channel materials for server and datacenter applications where chip costs are of less concern. Another segment may pursue more manufacturable transistor designs like the SegFET for mobile devices and sensors, for which low cost (rather than performance) is a major determining factor in product success.
99% BAD HARDWARE WEEK: IBM's 7 nm process is improvement in electron and hole mobility rather than in device geometry. Without process variability problems like at Intel.